Display Device and Electronic Device

ABSTRACT

A display device is disclosed. The display device includes a first substrate, a photosensitive layer, a liquid crystal layer, a second substrate, and a collimation layer that are stacked successively. The photosensitive layer comprises a plurality of photosensitive units. The second substrate comprises a plurality of display units and a shutter layer having a plurality of first holes, any adjacent two of the display units are spaced by the shutter layer, and one of the first holes is located between any adjacent two different ones of the display units. The collimation layer comprises a plurality of collimators, each of the plurality of collimators defines a second hole communicated with a corresponding one of the first holes and facing a corresponding one of the photosensitive units, and a light signal passes through the second hole and the corresponding one of the first holes and reaches the corresponding one photosensitive unit.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to Chinese Patent Application No.201910548879.6, filed on Jun. 24, 2019, the content of which is hereinincorporated by reference in its entirety.

TECHNICAL FIELD

The present disclosure generally relates to the technical field ofdisplay, and in particular to a display device and an electronic device.

BACKGROUND

In related technologies, the mobile phone has been equipped with afingerprint identification module and a display module. The fingerprintidentification module can be used for identifying the user's identity,and the display module can be used for displaying images. Currently,there is a way that the fingerprint identification module is stackedbelow the display module. The user contacts a corresponding position ofthe display module on the fingerprint module such that a fingerprint isformed. However, in the display area of the display module, only a smallpart can be touched by users for fingerprint identification.

SUMMARY

Embodiments of the present disclosure provides a display device, anelectronic device, and a method for obtaining an image.

According to one aspect of the present disclosure, a display deviceaccording to embodiments of the present disclosure includes a firstsubstrate, a photosensitive layer, a liquid crystal layer, a secondsubstrate, and a collimation layer that are stacked successively;wherein the photosensitive layer comprises a plurality of photosensitiveunits; wherein the second substrate comprises a plurality of displayunits and a shutter layer having a plurality of first holes, anyadjacent two of the plurality of display units are spaced by the shutterlayer, and one of the first holes is located between any adjacent twodifferent ones of the plurality of display units; and wherein thecollimation layer comprises a plurality of collimators, each of theplurality of collimators defines a second hole the second hole iscommunicated with a corresponding one of the first holes and faces acorresponding one of the photosensitive units, and a light signal passesthrough the second hole and the corresponding one of the first holes andreaches the corresponding one photosensitive unit.

According to another aspect of the present disclosure, an electronicdevice according to embodiments of the present disclosure includes: ahousing; and a display device installed in the housing and comprising afirst substrate, a photosensitive layer, a liquid crystal layer, asecond substrate, and a collimation layer that are stacked successively;wherein the photosensitive layer comprises a plurality of photosensitiveunits; wherein the second substrate comprises a plurality of displayunits and a shutter layer having a plurality of first holes, anyadjacent two of the plurality of display units are spaced by the shutterlayer, and each of the first holes is located between any adjacent twodifferent ones of the plurality of display units; and wherein thecollimation layer comprises a plurality of collimators, each of theplurality of collimators defines a second hole communicated with acorresponding one of the first holes and facing a corresponding one ofthe photosensitive units, and a light signal passes through the secondhole and the corresponding one of the first holes and reaches thecorresponding one photosensitive unit.

According to yet another aspect of the present disclosure, an electronicdevice, comprising a display assembly comprising a first substrate, aphotosensitive layer, a liquid crystal layer, a second substrate, and acollimation layer that are stacked successively; wherein thephotosensitive layer comprises a set of photosensitive units comprisingat least one photosensitive unit; wherein the second substrate comprisesa plurality of display units and a shutter layer having a plurality offirst holes, any adjacent two of the plurality of display units arespaced by the shutter layer, and each of the first holes is locatedbetween any adjacent two different ones of the plurality of displayunits; and wherein the collimation layer comprises a plurality ofcollimators, each of the plurality of collimators defines a second holecommunicated with a corresponding one of the first holes and facing acorresponding one of the at least one photosensitive unit, and a lightsignal passes through the second hole and the corresponding one of thefirst holes and reaches the corresponding one photosensitive unit.

Additional aspects and advantages of the present disclosure will be setforth in part in the following description. The part may become apparentfrom the description in the following, or be learnt about from thepractice of the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

The above and/or additional aspects and advantages of the presentdisclosure will become apparent and readily understood from thefollowing description in accordance with drawings.

FIG. 1 is a structural view of an electronic device according to someembodiments of the present disclosure;

FIG. 2 is a cross-sectional view of a display device according to someembodiments of the present disclosure;

FIG. 3 is a principle diagram of a display device for fingerprintidentification according to some embodiments of the present disclosure;

FIG. 4 is a stereoscopic view of a display device according to someembodiments of the present disclosure;

FIG. 5 is a structural view of a photosensitive layer and an imagingchip according to some embodiments of the present disclosure;

FIG. 6 is a structural view of a photosensitive layer and adisplay-driving layer according to some embodiments of the presentdisclosure;

FIG. 7 is a plane view of a second substrate according to someembodiments of the present disclosure;

FIG. 8 is a flow chart of a method for obtaining an image according toanother embodiment of the present disclosure;

FIG. 9 is a side view of a display device according to some embodimentsof the present disclosure;

FIG. 10 is a flow chart of a method for obtaining an image according toanother embodiment of the present disclosure;

FIG. 11 is a side view of a display device according to some embodimentsof the present disclosure; and

FIG. 12 and FIG. 13 are flow charts of a method for obtaining an imageaccording to another embodiment of the present disclosure.

DETAILED DESCRIPTION

The embodiments of the present disclosure will be described in detailbelow. Examples of the embodiments may be illustrated in the drawings.Same or similar reference numerals may be used to indicate same orsimilar elements or elements having same or similar functions.

Further, the embodiments described below with reference to the drawingsare illustrative and intended to describe the present disclosure, andare not intended to be construed as limiting of the present disclosure.

In the present disclosure, unless otherwise specification andlimitation, a first feature being “above” or “below” a second featuremay mean that the first feature is in direct contact with the secondfeature, or the first feature is in indirect contact with the secondfeature through an intermediate media. Moreover, the first feature being“on”, “above”, and “up” the second feature may mean that the firstfeature is directly or obliquely above the second feature, or only meanthat the first feature has a horizontal height higher than that of thesecond feature. The first feature being “under” “below”, “below” and“down” the second feature may mean that the first feature is directlybelow or obliquely below the second feature, or only indicate that thehorizontal height of the first feature is less than that of the secondfeature.

A display device is provided, including a first substrate, aphotosensitive layer, a liquid crystal layer, a second substrate, and acollimation layer that are stacked successively. Wherein thephotosensitive layer includes a plurality of photosensitive units;wherein the second substrate includes a plurality of display units and ashutter layer having a plurality of first holes, any adjacent two of theplurality of display units are spaced by the shutter layer, and each ofthe first holes is located between any adjacent two different ones ofthe plurality of display units; and wherein the collimation layerincludes a plurality of collimators, each of the plurality ofcollimators defines a second hole communicated with a corresponding oneof the first holes and facing a corresponding one of the photosensitiveunits, and a light signal passes through the second hole and thecorresponding one of the first holes and reaches the corresponding onephotosensitive unit.

In some embodiments, the display device has a display surface includinga display area, and projections of the plurality of photosensitive unitson the display surface are located in the display area.

In some embodiments, the display device has a display surface, eachcollimator is made from light-absorbing material, and an extensiondirection of the second hole is perpendicular to the display surface.

In some embodiments, a ratio of a section width of the second hole to adepth of the second hole is less than 0.2.

In some embodiments, the shutter layer is located between thecollimation layer and the plurality of photosensitive units, andprojections of the plurality of collimators on the second substrate arelocated on the shutter layer.

In some embodiments, reflective-material is arranged on a side of eachof the plurality of photosensitive units facing the first substrate.

In some embodiments, the plurality of photosensitive units are arrangedin an array, and the plurality of photosensitive units include one ormore of a plurality of stray light photosensitive units, a plurality ofnoise photosensitive units, and a plurality of infrared photosensitiveunits.

In some embodiments, the plurality of stray light photosensitive unitsare distributed in two columns of the array, and one of the two columnsis adjacent to one of two opposite edges of the array and the other ofthe two columns is adjacent to the other of the two opposite edges ofthe array.

In some embodiments, the display device further includes a cover plateincluding a display surface and a back surface that are opposite to eachother, an ink layer is arranged on the back surface, projections of thestray light photosensitive units on the back surface are located in anarea where the ink layer is located, and the ink layer is configured forblocking an external light signal penetrating into the cover plate.

In some embodiments, the ink layer is arranged near an edge of the backsurface.

In some embodiments, the plurality of noise photosensitive units aredistributed in two second columns of the array, and one of the twosecond columns of the array is near one of two opposite edges of thearray and the other of the two second columns of the array is near tothe other of the two opposite edges of the array.

In some embodiments, the display device further includes a blocker, theblock is arranged on a collimator facing a corresponding one of thenoise photosensitive units and is configured for blocking the secondhole of the collimator.

In some embodiments, the photosensitive layer further includes aplurality of circuit units including a plurality of photosensitivecircuit units and one or more noise circuit unit, and each of theplurality of the photosensitive units is connected with onephotosensitive circuit unit, each noise circuit unit is unconnected withany one of the plurality of the photosensitive units.

In some embodiments, the plurality of circuit units are arranged in anarray including a plurality of rows and a plurality of columns, and theone or more noise circuit unit is arranged in at least one whole row andone whole column of the array.

In some embodiments, the plurality of infrared photosensitive units areevenly distributed in the array.

In some embodiments, a plurality of display-driving units are arrangedon the first substrate and in a first array including a plurality ofrows and a plurality of columns;

the plurality of photosensitive units are arranged in a second arrayincluding a plurality of rows and a plurality of columns;

each row of the first array is located between any adjacent two rows ofthe second array, and each column of the first array is located betweenany adjacent two columns of the second array; and

the display-driving units have an effective operation time alternatedwith that of the photosensitive units in a same row or column.

An electronic device is further provided, including a housing and adisplay device installed in the housing and including a first substrate,a photosensitive layer, a liquid crystal layer, a second substrate, anda collimation layer that are stacked successively; wherein thephotosensitive layer includes a plurality of photosensitive units;wherein the second substrate includes a plurality of display units and ashutter layer having a plurality of first holes, any adjacent two of theplurality of display units are spaced by the shutter layer, and each ofthe first holes is located between any adjacent two different ones ofthe plurality of display units; and wherein the collimation layerincludes a plurality of collimators, each of the plurality ofcollimators defines a second hole communicated with a corresponding oneof the first holes and facing a corresponding one of the photosensitiveunits, and a light signal passes through the second hole and thecorresponding one of the first holes and reaches the corresponding onephotosensitive unit.

In some embodiments, the plurality of photosensitive units are arrangedin an array and include one or more of a plurality of stray lightphotosensitive units, a plurality of noise photosensitive units, and aplurality of infrared photosensitive units.

An electronic device is further provided, including a display assemblyincluding a first substrate, a photosensitive layer, a liquid crystallayer, a second substrate, and a collimation layer that are stackedsuccessively; wherein the photosensitive layer includes a set ofphotosensitive units including at least one photosensitive unit; whereinthe second substrate includes a plurality of display units and a shutterlayer having a plurality of first holes, any adjacent two of theplurality of display units are spaced by one of the first holes; andwherein the collimation layer includes a plurality of collimators, eachof the plurality of collimators defines a second hole communicated witha corresponding one of the first holes and facing a corresponding one ofthe at least one photosensitive unit, and a light signal passes throughthe second hole and the corresponding one of the first holes and reachesthe corresponding one photosensitive unit.

In some embodiments, the set of photosensitive units is arranged in anarray include one or more of a plurality of stray light photosensitiveunits, a plurality of noise photosensitive units, and a plurality ofinfrared photosensitive units.

As shown in FIG. 1, the electronic device 1000 according to someembodiments of the present disclosure includes a housing 200 and adisplay device 100. The display device 100 is mounted on the housing200. Specifically, the electronic device 1000 can be a mobile phone, atablet computer, a display, a notebook computer, a teller machine, agate machine, a smart watch, a head display device, a game machine andother devices. The present disclosure is described as taking theelectronic device 1000 being a mobile phone as an example. It can beunderstood that the specific form of the electronic device 1000 is notlimited to the mobile phone.

The housing 200 can be used for mounting the display device 100. Inother words, the housing 200 can be used as an installation carrier forthe display device 100. The housing 200 can also be used for mountingfunctional modules such as a power supply device, an imaging device, anda communication device of the electronic equipment 1000, and thus thehousing 200 provides protection against falling, water and the like forthe functional modules.

The display device 100 can be used for displaying images, videos, texts,etc. The display device 100 is installed on the housing 200.Specifically, the display device 100 can be mounted on the front of thehousing 200, the display device 100 can be installed on the back of thehousing 200, the display device 100 can be installed on the front andback of the housing 200 at the same time, or the display device 100 canbe installed on a side of the housing 200, which are not limited herein.In an example shown in FIG. 1, the display device 100 is mounted on thefront of the housing 200.

As shown in FIGS. 2-4, the display device 100 includes a first substrate30, a photosensitive layer 40, a liquid crystal layer 50, a secondsubstrate 60, and a collimation layer 70, which are stackedsuccessively. The photosensitive layer 40 includes a plurality ofphotosensitive units 41. The second substrate 60 includes a plurality ofdisplay units 61 and a shutter layer 62. The shutter layer 62 defineslight-passing holes 621, and any adjacent two of the plurality ofdisplay units are spaced by the shutter layer 62, and each of the firstholes is located between any adjacent two different ones of theplurality of display units 61. The collimation layer 70 include aplurality of collimators 71 each of which defines a light-through hole711. The light-through hole 711 is communicated with a corresponding oneof the light-passing holes 621 and faces a corresponding one of thephotosensitive units 41. A light signal passes through the light-throughhole 711 and the corresponding one of the light-passing holes 621 andreaches the corresponding one photosensitive unit 41.

In the electronic device 1000 according to some embodiments of thepresent disclosure, the photosensitive units 41 can receive the lightsignals from the outside and passing through the light-through holes 711and the light-passing holes 621. According to the light signals, animage of an object touching on the display device 100 can be obtained.The image can be used for fingerprint identification. At the same time,a ratio of an area of multiple photosensitive units 41 to an area of adisplay surface 91 of the display device 100 becomes large as themultiple photosensitive units 41 are distributed according to demands.Thus, fingerprint identification can be performed on a large region forusers, and then the user experience is good.

Specifically, the display device 100 may display light signals sent froma light-emitting element therein. The display device 100 may alsodisplay light signals sent from an external light source. The displaydevice 100 may be un-bendable, and the display device 100 may also bebendable, which is not limited herein.

In some embodiments of the present disclosure, as shown in FIGS. 2-4,the display device 100 includes a backlight layer 10, a firstpolarization layer 20, a first substrate 30, a photosensitive layer 40,a liquid crystal layer 50, a second substrate 60, a collimation layer70, a second polarization layer 80, and a cover plate 90, which aresuccessively arranged along a direction of lights emitted from thedisplay device 100.

As shown in FIG. 2 and FIG. 3, the backlight layer 10 can be used foremitting a light signal La, or the backlight layer 10 can be used forguiding a light source (which is not shown in the figures) to emit thelight signal La. The light signal La successively passes through thefirst polarization layer 20, the first substrate 30, the photosensitivelayer 40, the liquid crystal layer 50, the second substrate 60, thecollimation layer 70, the second polarization layer 80, and the coverplate 90, and then enters outside. The backlight layer 10 includes abottom surface 11. In specific, the bottom surface 11 of the backlightlayer 10 is opposite to the first polarization layer 20.

The first polarization layer 20 is arranged on the backlight layer 10.Specifically, the first polarization layer 20 can be a polarizer or apolarizing film. The first substrate 30 is arranged on the firstpolarization layer 20. The first substrate 30 can be a glass substrate.

The photosensitive layer 40 may be a film layer made on the firstsubstrate 30, for example, by a TFT (thin film Transistor) process. Asshown in FIGS. 4-6, the photosensitive layer 40 includes a plurality ofphotosensitive units 41 and a plurality of circuit units 42.

A photosensitive unit 41 can convert a received light signal into anelectrical signal through the photoelectric effect. The intensity of theelectrical signal generated by the photosensitive unit 41 indicates theintensity of the light signal received by the photosensitive unit 41. Inone example, the photosensitive unit 41 may only receive a visible lightsignal to convert it into an electrical signal. In another example, thephotosensitive unit 41 may only receive an invisible light signal toconvert it into an electrical signal. In yet another example, thephotosensitive unit 41 may receive both a visible light signal and aninvisible light to convert them into an electrical signal. The pluralityof photosensitive units 41 may have a same type, and the plurality ofphotosensitive units 41 may also have totally-different types from eachother. The plurality of photosensitive units 41 can be arranged in anyway, and the arrangement of the photosensitive units 41 can bespecifically set according to a shape of the display device 100 andother requirements. In embodiments of the present disclosure, theplurality of photosensitive units 41 are arranged in an array. Forexample, the plurality of photosensitive units 41 are arranged in anarray with multiple rows and multiple columns. Each photosensitive unit41 can operate independently without being affected by otherphotosensitive units 41. Light signals received by the photosensitiveunits 41 at different positions may have different intensities, and thuselectrical signals generated by the photosensitive units 41 at differentpositions may also have different intensities. Further, reflectionmaterial may be set at a side of the photosensitive units 41 toward thebottom surface 11. Light signals, which are irradiated from thebacklight layer 10 to the photosensitive units 41, may be reflected bythe reflective-material, so as to avoid the influence of these lightsignals on the accuracy of imaging by the photosensitive layer 40.

A circuit unit 42 may be connected to a photosensitive unit 41. Thecircuit unit 42 may transmit the electrical signals generated by thephotosensitive unit 41 to an imaging chip 300 of the electronic device1000. The circuit unit 42 may specifically include components such as atransistor. As the number of circuit units 42 may be multiple, eachphotosensitive unit 41 may be connected to one circuit unit 42. Themultiple circuit units 42 may be connected to an imaging chip 300through connection wires. The arrangement of the plurality of circuitunits 42 may be similar to that of the photosensitive units 41. Forexample, the plurality of photosensitive units 41 may be arranged intoan array with multiple rows and multiple columns, and the plurality ofcircuit units 42 may also be arranged into an array with multiple rowsand multiple columns.

As shown in FIGS. 2-4, the liquid crystal layer 50 is arranged on thephotosensitive layer 40. The deflection direction of Liquid crystalmolecules in the liquid crystal layer 50 can be changed under theelectric field, so as to change an amount of light signals that can passthrough the liquid crystal layer 50. Accordingly, combined with FIG. 6,a display-driving layer 1 a can also be fabricated on the firstsubstrate 30, and under the driving effect of a driving chip (not shownin the figures), the display-driving layer 1 a can apply an electricalfield to the liquid crystal layer 50 to control the deflection directionof the liquid crystal molecules at different positions. Specifically,the display-driving layer 1 a includes a plurality of display-drivingunits 1 a 1, and each display-driving unit 1 a 1 can independentlycontrol the deflection direction of the liquid crystal molecules at acorresponding position.

As shown in FIG. 2, FIG. 4, and FIG. 7, the second substrate 60 isarranged on the liquid crystal layer 50. The second substrate 60 mayinclude a glass substrate and a plurality of display units 61 and ashutter layer 62 arranged on the glass substrate. The display units 61may be a color filter, for example, R represents a red filter, Grepresents a green filter, and B represents a blue filter. The amount oflight signals passing through filters for different colors is controlledto control the color finally displayed on the display device 100. Thearrangement of the plurality of display units 61 may correspond to thearrangement of the plurality of display-driving units 1 a 1. Forexample, one display unit 61 is aligned with one display-driving unit 1a 1.

Any two adjacent display units 61 are separated by the shutter layer 62.In one example, the shutter layer 62 may be a black matrix (BM). Theshutter layer 62 can prevent light from passing through, so as to avoidthe lights in the display device 100 from entering outside withoutpassing through the display units 61. The shutter layer 62 can alsoprevent the phenomenon of optical crosstalk when the light signalspasses through the adjacent display unit 61.

As shown in FIG. 3, the shutter layer 62 defines multiple light-passingholes 621. The light-passing holes 621 can be used for light signals topass through. A light-passing hole 621 is aligned with a photosensitiveunit 41, which means the center line of the light-passing hole 621passes through the photosensitive unit 41. During a light signal passingthrough the light-passing hole 621, if the light signal reaches an innerwall of the light-passing hole 621, the light signal will be partiallyor completely absorbed by the inner wall of the light-passing hole 621.Thus, the propagation direction of the light signal that can passthrough the light-passing hole 621 is almost coincided with an extensiondirection of the center line of the light-passing hole 621. Thelight-passing holes 621 are distributed in a manner same with that inwhich the photosensitive units 41 are distributed, so that eachphotosensitive unit 41 is aligned with one light-passing hole 621.

As shown in FIGS. 2-4, the collimation layer 70 is arranged on thesecond substrate 60. The collimation layer 70 includes a plurality ofcollimators 71. Each collimator 71 defines a light-through hole 711which is aligned with a corresponding photosensitive unit 41. That is,the light-through hole 711 faces the photosensitive unit 41.Specifically, the light-through hole 711 can also be aligned with alight-passing hole 621. That is, the center line of the light-throughhole 711 can coincide with the center line of the light-passing hole621. A light signal can pass through the light-through hole 711 and thenthe light-passing hole 621 to reach the photosensitive unit 41. Thematerial of the collimators 71 may be same as that of the shutter layer62. For example, both the collimators 71 and the shutter layer 62 aremade from the light-absorbing material. When reaching a body of acollimator 71, a light signal will be partially or completely absorbed.For example, when the light signal reaches a side wall of the collimator71 or an inner wall of the light-through hole 711, the light signal willbe absorbed by the collimator 71, and thus light signals whosepropagation direction is coincided with the extension direction of thecenter line of the light-through hole 711 passes through thelight-through hole 711 and reaches the photosensitive unit 41. Thus,collimation of light signals is realized, and there are lessinterference light signals received by the photosensitive unit 41. Theorthographic projection of the plurality of collimator 71 on the secondsubstrate 60 may be located in the shutter layer 62, which makes thecollimator 71 not block the display unit 61 and ensures that the displaydevice 100 has a better display effect.

The light-through hole 711 extends in a direction perpendicular to thedisplay surface 91, so that only light signals whose propagationdirection is perpendicular to the display surface 91 pass through thelight-through hole 711. In other words, only light signals which arepropagated vertically downward from the display surface 91 can only passthrough the light-through hole 711. A ratio of a section width of thelight-through hole 711 to a depth of the light-through hole 711 is lessthan 0.2. The depth of the light-through hole 711 may means a depthalong the center line of the light-through hole 711, and the sectionwidth of the light-through hole 711 may indicates the maximum of sizesof patterns cut by planes perpendicular to the center line of thelight-through hole 711. The ratio may be 0.1, 0.111, 0.125, 0.19, 0.2,or other values, in which the corresponding collimator 71 has goodcollimation effect on light signals.

In one example, the collimation layer 70 further includes a substrate72, the substrate 72 may be substantially transparent, and thecollimators 71 are formed on the substrate 72. In another example, thecollimation layer 70 may only include the collimators 71, and thecollimators 71 are formed on the second substrate 60 by coating,sputtering, or the like.

The second polarization layer 80 is arranged on the collimation layer70, and the second polarization layer 80 can be a polarizer or apolarizing film specifically.

As shown in FIG. 2 and FIG. 3, a cover plate 90 is arranged on thesecond polarization layer 80. The cover plate 90 can be made from glass,sapphire, or other materials. The cover plate 90 includes a displaysurface 91 and a back surface 92. Light signals sent from the displaydevice 100 enters outside after passing through the display surface 91,and external lights enters the display device 100 after passing throughthe display surface 91. The back surface 92 can be bonded to the secondpolarization layer 80. In some examples, the display device 100 may alsonot include the cover plate 90, and in this case the display device 100has the display surface formed on the second polarization layer 80.

The display surface 91 includes a display area 911. The display area 911refers to an area that can be used for displaying images, and thedisplay area 911 may be a rectangle, a circle, a rounded rectangle, arectangle with “bangs”, which is not limited herein. In addition, insome examples, the display surface 91 can also include a non-displayarea. The non-display area can be arranged along edges of the displayarea 911, and the non-display area can be used for being connected withthe housing 200. A ratio of the display area 911 on the display surface91 can be any value such as 80%, 90%, 100%.

In embodiments of the present disclosure, projections of the pluralityof photosensitive units 41 on the display surface 91 are located in thedisplay area 911. Thus, the plurality of photosensitive units 41 canperforms imaging for an object touching the display area 911. For anexample of a finger touching the display area 911, the plurality ofphotosensitive units 41 can performs imaging for the fingerprinttouching the display area 911 and be used for fingerprintidentification.

As shown in FIG. 2 and FIG. 3, specific details of the imaging of thedisplay device 100 will be described in the following. A light signal Laemitted from the display device 100 passes through the firstpolarization layer 20, the first substrate 30, the photosensitive layer40, the liquid crystal layer 50, the second substrate 60, thecollimation layer 70, the second polarization layer 80, and the coverplate 90 successively and then enters outside, and an external lightsignal also passes through the cover plate 90, the second polarizationlayer 80, the collimation layer 70, the second substrate 60, and theliquid crystal layer 50 and then reaches the photosensitive layer 40. Ifthe light signal just reaches the photosensitive units 41 in thephotosensitive layer 40, the photosensitive units 41 generates anelectrical signal indicating the intensity of the light signal. Thus,the intensity of the electrical signals of the plurality ofphotosensitive units 41 can indicates the intensity distribution oflight signals entering the display device 100.

In an example where a user's finger 2000 touches the display surface 91,the finger 2000 touches a predetermined area of the display surface 91when the display device 100 is emitting a light signal La, and the lightsignal La is reflected by the finger 2000 to obtain a light signal L1.The light signal L1 then enters the display device 100, and then thelight signal L1 passes through the cover plate 90 and the secondpolarization layer 80 firstly. As the light signal L1 is propagated in adirection same with the extension direction of a light-through hole 711and a light-passing hole 611, the light signal L1 further passes throughthe light-through hole 711 and the light-passing hole 621, and then thelight signal L1 passes through the liquid crystal layer 50 and reaches aphotosensitive unit 41 after passing through light-through hole 711 andthe light-passing hole 621. For light signals which are propagated in adirection different with the extension direction of a light-through hole711 and a light-passing hole 611, the light signals fails to passthrough the light-through hole 711 and the light-passing hole 621 afterpassing through the cover plate 90 and the second polarization layer 80,and then fails to a photosensitive unit 41 aligned with thelight-through hole 711 and the light-passing hole 621.

It can be understood that there are peaks and troughs in a fingerprint.When the finger 2000 touches the display surface 91, the peaks directlycontact with the display surface 91, and there is a gap between thetroughs and the display surface 91. After the light signal La reachesthe peaks and the troughs, a light signal reflected by the peaks(referred to as a first light signal hereinafter) has an intensitydifferent from that of a light signal reflected by the troughs (referredto as a second light signal hereinafter). Thus, there is a differencebetween intensities of an electrical signal generated by the receivedfirst light signal (referred to as a first electrical signalhereinafter) and an electrical signal generated by the received secondlight signal (referred to as a second electrical signal hereinafter).The imaging chip 300 obtains an image of the fingerprint according tothe distribution of the first electrical signals and the secondelectrical signals. The image of the fingerprint may further used forfingerprint recognition.

It can be understood that a user touches an area above any area with aphotosensitive unit 41, and then a purpose that a fingerprint can beimaged and identified may be achieved. When a photosensitive unit 41 isarranged under any of the display area 911, the user touches anyposition of the display area 911 and then a purpose that a fingerprintcan be imaged and identified may be achieved, without limiting somespecific positions of the display area 911. Meanwhile, the user may alsotouch multiple positions of the display area 911 at same time throughmultiple fingers, or multiple users touch multiple positions of thedisplay area 911 simultaneously, thus, a purpose that multiplefingerprints can be imaged and identified may be achieved. Therefore,this can enrich verification methods and applicable scenarios of theelectronic device 1000. For example, only after the multiplefingerprints pass verification at the same time, authorization is givenand the multiple users can play games on the same electronic device1000.

Of course, similar to the finger of the user touching the display area911, any object (e.g. the user's arm, forehead, clothing, flowers andplants, etc.) that can reflect the light signal La touches the displayarea 911 and then an imaging process is performed for a texture of thesurface of the object. The subsequent processes after the imagingprocess can be set according to the user's requirements, which are notlimited herein.

As shown in FIG. 8, a method for obtaining an image is also disclosedaccording to some embodiments of the present disclosure. The method canbe applied for the above-mentioned display device 100. The methodincludes actions/operations in the following blocks.

At 01, the method receives an imaging light signal which includes atarget light signal.

At 02, the method obtains an image according to the imaging lightsignal.

The block 01 is performed by the photosensitive layer 40, and the block02 is performed by the imaging chip 300. The imaging light signal refersto all light signals received by the photosensitive units 41, and thetarget light signal means light signals that reaches the photosensitiveunits 41 after passing through the light-through holes 711 and thelight-passing holes 621. The specific implementation details for theblocks 01 and 02 can refer to the above description of the displaydevice 100, and will not be described herein.

Therefore, in the electronic device 1000 and the method according toembodiments of the present disclosure, the photosensitive units 41 canreceive the light signals from outside and passing through thelight-through holes 711 and the light-passing holes 621. According tothe light signals, an image of an object touching the display device 100can be obtained. The image can be used for fingerprint identification.At the same time, a ratio of an area of multiple photosensitive units 41to an area of a display surface 91 of the display device 100 becomeslarge as the multiple photosensitive units 41 are distributed accordingto demands. Thus, fingerprint identification can be performed on a largeregion for users, and then the user experience is good.

As shown in FIG. 5 and FIG. 9, in some embodiments, the photosensitiveunits 41 includes a plurality of stray light photosensitive units 411.An ink layer 93 is arranged on the back surface 92 of the cover plate90, and an area where the stray light sensing units 411 is locatedcorresponds to the ink layer 93. That is, the area where the stray lightsensing units 411 is located faces the ink layer 93. The ink layer 93may be used for blocking a light signal Lb penetrating into the coverplate 90 from outside.

In practical application, a part of light signals emitted from thebacklight layer 10 penetrates directly from the display surface 91,another part of the light signals is reflected once or more timesbetween the display surface 91 and the backlight layer 10, and yetanother part of the light signals may reach the photosensitive units 41and cause interference to the imaging of the display device 100. Thatis, the imaging light signal for imaging further includes aninterference light signal L2, which is reflected by the display device100 and reaches the photosensitive units 41 on the photosensitive layer40.

The ink layer 93 is arranged at a position corresponding to the straylight photosensitive units 411 on the back surface 92. Most of lights inthe display device 100 are absorbed by the ink layer 93 after reachingthe ink layer 93, and a small part (for example, 4%) is reflected by theink layer 93. The ink layer 93 may simulate the reflection effect of thecover plate 90 on the light signal inside the display device 100. Inaddition, the stray light photosensitive units 411 may receive the lightsignal L2 reaching the stray light sensitive units 411 from sides of thestray light photosensitive units 411. Generally speaking, the straylight photosensitive units 411 can receive the same interference lightsignal L2 as well as other photosensitive units 41. Meanwhile, the inklayer 93 can block (reflect or absorb) the light signal Lb penetratinginto the cover plate 90 from outside, so that the stray lightphotosensitive unit 411 can only receive the interference light signalL2, and other photosensitive units 41 can simultaneously receive theinterference light signal L2 and the light signal Lb penetrating intothe cover plate 90 from outside.

The type and performance of the stray light photosensitive units 411 arethe same as those of the other photosensitive units 41. The stray lightphotosensitive units 411 transmits the interference electrical signalgenerated by the interference light signal L2 to the imaging chip 300,and the imaging chip 300 performs image-calibration according to theinterference electrical signal during imaging, for example, subtractingthe interference electrical signal from the imaging electrical signalgenerated by the imaging light signal as a final electrical signal forimaging, in order to obtain a more accurate image and improve theaccuracy of image identification.

In one example, the stray light sensitive units 411 and the otherphotosensitive units 41 are CCD image sensors. In this case, subtractingthe interference electrical signal from the imaging electrical signalmay be performed in the imaging chip 300. That is, both the interferenceelectrical signal and the imaging electrical signal are transmitted tothe imaging chip 300, and the imaging chip 300 subtracts theinterference electrical signal from the imaging electrical signal.Subtracting the interference electrical signal from the imagingelectrical signal may also be performed in an analog-to-digitalconverter. That is, both the interference electrical signal and theimaging electrical signal are transmitted to the analog-to-digitalconverter, and the analog-to-digital converter subtracts theinterference electrical signal from the imaging electrical signal andtransmits an electrical signal obtained after the subtracting. Inanother example, the stray light sensitive units 411 and the otherphotosensitive units 41 are CMOS image sensors. In this case,subtracting the interference electrical signal from the imagingelectrical signal may be performed in the imaging chip 300. That is,both the interference electrical signal and the imaging electricalsignal are transmitted to the imaging chip 300, and the imaging chip 300subtracts the interference electrical signal from the imaging electricalsignal. Subtracting the interference electrical signal from the imagingelectrical signal may also be performed in the photosensitive units 41.At this case, each photosensitive unit 41 includes a first storage area,a second storage area, and a logic subtraction circuit. The generatedimaging electrical signal is stored in the first storage area of thephotosensitive unit 41, and the interference electrical signal is sentfrom the stray light sensitive units 411 and stored in the secondstorage area of the photosensitive unit 41. The interference electricalsignal is subtracted from the imaging electrical signal by the logicsubtraction circuit, and the electrical signal obtained after thesubtracting is sent to the imaging chip 300. The above description ofthe subtracting the interference electrical signal from the imagingelectrical signal are only illustrative and not constructed as thelimitation of the present disclosure.

In one example, the ink layer 93 is arranged near an edge of the backsurface 92, and the stray light photosensitive units 411 are arranged ata corresponding edge of the photosensitive layer 40. For example, thestray light photosensitive units 411 are arranged in an area ‘a’ asshown in FIG. 5, wherein the area ‘a’ is located on the leftmost columnand the rightmost column of the array of photosensitive units 41 asshown in FIG. 5. That is, the area ‘a’ includes the leftmost column andthe rightmost column of the array of photosensitive units 41 that areadjacent to two opposite edges (i.e. left edge and right edge) of thearray of the photosensitive units 41 respectively. Thus, the ink layer93 is avoided to have too much influence on the display effect of thedisplay device 100. Specifically, the photosensitive units 41 may bearranged in a array with multiple rows and multiple columns, and thestray light photosensitive units 411 may be arranged at a position nearan edge of the array, such as one to three columns adjacent to the edgeof the array or one to three rows adjacent to the edge of the array, soas to adapt to the position where the ink layer 93 is located.

Further, as there are multiple stray light photosensitive units 411,there generate multiple interference electrical signals accordinglywhich have different sizes, in one example, the interference electricalsignals are averaged and then the averaged interference electricalsignal is subtracted from the imaging electrical signal duringperforming the subtraction operation. In another example, photosensitiveunits 41 and stray light photosensitive units 411 are partitionedrespectively, where each region include at least one photosensitive unit41, or includes at least one stray light photosensitive unit 411.According to a location of each region including a photosensitive unit41 (referred to as a first region hereinafter) and a location of eachregion including a stray light photosensitive unit 411 (referred to as asecond region hereinafter), second regions that are closest to eachfirst region are determined. For each photosensitive unit 41 in eachfirst region, an interference electrical signal generated by a straylight photosensitive unit 411 in a second region that is closest to thefirst region is subtracted from an imaging electrical signal generatedby the photosensitive unit 41, such that a final electrical signal ofthe photosensitive unit 41 for imaging is obtained. If the second regionincludes multiple stray light photosensitive units 411, an average valueof multiple interference electrical signals generated by the multiplestray light photosensitive units 411 in the second region are obtained,and then the average value is subtracted from the imaging electricalsignal, such that a final electrical signal for imaging is obtained. Itcan be appreciated that the closer a distance between a stray lightphotosensitive unit 411 and a photosensitive unit 41 is, the closeramounts of interference light signals received by the stray lightphotosensitive unit 411 and the photosensitive unit 41 are, and thecloser the generated interference electrical signals are. Thus, moreaccurate the final electrical signal for imaging after subtracting theinterference electrical signal from the imaging electrical signal are.

As shown in FIG. 10, in some embodiments, the method further includesobtaining an interference light signal at 03. The actions/operations at02 include obtaining the image according to the imaging light signal andthe interference light signal at 021.

The block 03 is performed by the stray light photosensitive units 411,and the block 021 is performed by the imaging chip 300. The specificimplementation details for the blocks 03 and 021 can refer to the abovedescription, and will not be described herein.

As shown in FIG. 5 and FIG. 11, in some embodiments, the photosensitiveunit 41 includes a plurality of noise photosensitive units 412, and thedisplay device 100 further includes a plurality of blockers 73. Ablocker 73 is arranged on a collimator 71 facing a corresponding one ofthe noise photosensitive units 412. The blocker 73 is used for blockinga light-through hole 711 of the collimator 71 facing the correspondingnoise photosensitive unit 412.

During using, the temperature of a photosensitive unit 41 or thetemperature of the environment changes, and as the temperature changes,the performance of the photosensitive unit 41 may change. This resultsin inconsistent electrical signals generated when light signals withsame intensity are received. Therefore, calibration is performed forinterference resulted from the changed temperatures during an imaging.

In this embodiment, the type and performance of the noise photosensitiveunits 412 are the same as those of the other photosensitive units 41.The blocker 73 blocks the light-through hole 711, so that the noisephotosensitive units 412 cannot receive a light signal. The noisephotosensitive units 412 generates an electrical signal when being used,and as the noise photosensitive units 412 cannot receive a light signal,the electrical signal generated by the noise photosensitive units 412indicates a noise electrical signal resulted from material and thechanged temperatures. Other photosensitive units 41 generate a noiseelectrical signal simultaneously and receive an imaging light signal togenerate an imaging electrical signal. The noise photosensitive units412 transmit the noise electrical signal to the imaging chip 300. Theimaging chip 300 performs image-calibration for the noise electricalsignal according to the noise electrical signal during imaging, forexample, subtracting the noise electrical signal from the imagingelectrical signal generated from the imaging light signal as a finalelectrical signal for imaging, in order to obtain a more accurate imageand improve the accuracy of image identification. Similar to a casewhere the photosensitive units 41 include a plurality of stray lightphotosensitive units 411, subtracting the noise electrical signal fromthe imaging electrical signal may be performed in the imaging chip 300,and may also be performed in other components, which is not describedherein.

Specifically, the blocker 73 may also be made from light-absorbingmaterial. The blocker 73 can be filled in the light-through hole 711,and the blocker 73 and the corresponding collimator 71 can be madetogether. In one example, blockers 73 may also be arranged on the noisephotosensitive units 412 directly, such that the noise photosensitiveunits 412 cannot receive a light signal completely. The noisephotosensitive units 412 may be arranged at a region near an edge of anarray of photosensitive units 41. The noise photosensitive unit 412 maybe arranged at a region adjacent to the stray light photosensitive units411 such as one to three columns in the array or one to three rows inthe array, which is not limited. The noise photosensitive units 412 arearranged in an area ‘b’ as shown in FIG. 5, and the area ‘b’ is locatedon the second column from the left and the second column from the rightof the array of photosensitive units 41 as shown in FIG. 5. That is, thearea ‘b’ includes the second column near the left edge of the array andthe second column near the right edge of the array.

Further, as there are multiple noise photosensitive units 412, and theregenerate multiple noise electrical signals accordingly which havedifferent sizes, in one example, the noise electrical signals areaveraged and then the averaged noise electrical signal is subtractedfrom the imaging electrical signal during performing the subtractionoperation. In another example, photosensitive units 41 and noisephotosensitive units 412 are partitioned respectively, where each regioninclude at least one photosensitive unit 41, or includes at least onenoise photosensitive unit 412. Then, according to a location of eachregion including a photosensitive unit 41 (referred to as a first regionhereinafter) and a location of each region including a noisephotosensitive unit 412 (referred to as a third region hereinafter),third regions that are closest to each first region are determined. Foreach photosensitive unit 41 in each first region, a noise electricalsignal generated by a noise photosensitive unit 412 in a third regionthat is closest to the first region is subtracted from an imagingelectrical signal generated by the photosensitive unit 41, such that afinal electrical signal of the photosensitive unit 41 for imaging isobtained. If the third region includes multiple noise photosensitiveunits 412, an average value of multiple noise electrical signalsgenerated by the multiple noise photosensitive units 412 in the thirdregion are obtained, and then the average value is subtracted from theimaging electrical signal, such that a final electrical signal forimaging is obtained. It can be appreciated that the closer a distancebetween a noise photosensitive unit 412 and a photosensitive unit 41 is,the closer temperatures of the noise photosensitive unit 412 and thephotosensitive unit 41 are, and the closer the generated noiseelectrical signals are. Thus, more accurate the final electrical signalfor imaging are after subtracting the noise electrical signal from theimaging electrical signal.

As shown in FIG. 5, in some embodiments, the circuit units 42 includephotosensitive circuit units 421 and one or more noise circuit unit 422.A photosensitive circuit unit 421 is connected with a photosensitiveunit 41, and the noise circuit unit 422 is not connected with aphotosensitive unit 41.

A photosensitive circuit itself has hardware noise which can cause acircuit noise signal, and the circuit noise signal affects the strengthof the electrical signal finally transmitted to the imaging chip 300.Therefore, calibration is performed for interference resulted from thecircuit noise signal during imaging.

In this embodiment, the noise circuit unit 422 is not connected with aphotosensitive unit 41, and the circuit noise signals generated on thenoise circuit unit 422 are resulted from hardware noise of the noisecircuit unit 422 itself. The noise circuit unit 422 transmits thecircuit noise signal to the imaging chip 300. The imaging chip 300performs image-calibration according to the circuit noise signal duringimaging, for example, subtracting the circuit noise signal from theimaging electrical signal generated from the imaging light signal as afinal electrical signal for imaging, in order to obtain a more accurateimage and improve the accuracy of image identification.

Specifically, a plurality of circuit units 42 can be arranged in anarray with multiple rows and multiple columns. Noise circuit units 422are arranged in at least one complete row and column, and the noisecircuit unit 422 can be distributed in any row and column. A circuitnoise signal generated by the noise circuit units 422 is morecomprehensive, and calibration effect becomes better whenimage-calibration is performed according to the circuit noise signal.Noise circuit units 422 may also be arranged at an edge of the array ofthe circuit units 42, or near the stray light photosensitive units 411and the noise photosensitive units 412 mentioned above. A distributionrange of noise circuit units 422 covers one to five columns completelyand one to five rows completely, which is not limited herein. In anexample of FIG. 5, the noise circuit units 422 are arranged in an area‘c’ of the photosensitive layer 40, and the area ‘c’ is located on thethird column from the left, the third column from the right, the upperrow, and the bottom row of the array of circuit units 42 as shown inFIG. 5. That is, the area ‘c’ includes the third column near the leftedge of the array and the third column near the right edge of the array.

Further, as there are multiple noise circuit units 412, and theregenerate multiple circuit noise signals accordingly which have differentsizes, in one example, the circuit noise signals are averaged and thenthe averaged circuit noise signal is subtracted from the imagingelectrical signal during performing the subtraction operation. Inanother example, photosensitive units 41 and noise circuit units 422 arepartitioned respectively, where each region include at least onephotosensitive unit 41, or includes at least one noise circuit unit 422.Then, according to a location of each region including a photosensitiveunit 41 (referred to as a first region hereinafter) and a location ofeach region including a noise circuit unit 422 (referred to as a fourthregion hereinafter), fourth regions that are closest to each firstregion are determined. For each photosensitive unit 41 in each firstregion, a circuit noise signal generated by a circuit noise unit 422 ina fourth region that is closest to the first region is subtracted froman imaging electrical signal generated by the photosensitive unit 41,such that a final electrical signal of the photosensitive unit 41 forimaging is obtained. If the fourth region includes multiple circuitnoise units 422, an average value of multiple circuit noise signalsgenerated by the multiple circuit noise units 422 in the fourth regionare obtained, and then the average value is subtracted from the imagingelectrical signal, such that a final electrical signal for imaging isobtained.

As shown in FIG. 12, in some embodiments, the method further includesobtaining a circuit noise signal at 04. The actions/operations at 02include obtaining the image according to the imaging light signal andthe circuit noise signal at 022.

The block 04 is performed by the circuit noise units 422, and the block022 is performed by the imaging chip 300. The specific implementationdetails for the blocks 04 and 022 can refer to the above description,and will not be described herein.

As shown in FIG. 5, in some embodiments, the photosensitive units 41include a plurality of infrared photosensitive units 413. The infraredphotosensitive units 413 are used for detecting infrared lights.

As there may exist infrared lights in the external environment, theinfrared lights may penetrate into certain objects and enter the displaydevice 100. The infrared lights may penetrate into the user's finger andthen pass through the display surface 91, the through light-passingholes 711, and the light-passing holes 621, and then the infrared lightsare received by the photosensitive units. However, the infrared lightsare not associated with the user's fingerprint, and infrared electricalsignal generated from the infrared lights (i.e. infrared light signals)may have interference on the imaging of the imaging chip 300. Therefore,calibration is performed for the interference resulted from the infraredlight signals during imaging.

The infrared photosensitive units 413 only receives an infrared signaland generates an infrared electrical signal according to the infraredsignal. Other photosensitive units 41 simultaneously receives theinfrared signal and a visible light signal and generate an imagingelectrical signal based on the infrared signal and the visible lightsignal. The infrared electrical signal is further transmitted to theimaging chip 300. The imaging chip 300 performs image-calibrationaccording to the infrared electrical signal during imaging, for example,subtracting the infrared electrical signal from the imaging electricalsignal generated from the imaging light signal as a final electricalsignal for imaging, in order to obtain a more accurate image and improvethe accuracy of image identification. Similar to a case where thephotosensitive units 41 include a plurality of stray lightphotosensitive units 411, subtracting the infrared electrical signalfrom the imaging electrical signal may be performed in the imaging chip300, and may also be performed in other components, which is notdescribed herein.

Specifically, the infrared photosensitive units 413 may be spaced fromeach other. For example, the infrared photosensitive units 413 areevenly distributed in array of photosensitive cell 41. A ratio of theinfrared photosensitive units 413 to the photosensitive units 41 may bea small value, such as 1%, 7%, 10%. Combined with FIG. 3, a touchedposition may be sensed in the display device 100 when the displaysurface 91 is touched by a user, and the imaging chip 300 reads aninfrared electrical signal generated by one or more infraredphotosensitive units 413 corresponding to the touched position andperforms image-calibration according to the infrared electrical signal.

As shown in FIG. 13, in some embodiments, the method further includesobtaining an infrared signal at 05. The actions/operations at 02 includeobtaining the image according to the imaging light signal and theinfrared signal at 023.

The block 05 is performed by the infrared photosensitive units 413, andthe block 023 is performed by the imaging chip 300. The specificimplementation details for the blocks 05 and 023 can refer to the abovedescription, and will not be described herein.

Furthermore, in some embodiments, there are no infrared photosensitiveunits 413 while an infrared cut-off film may be arranged between thephotosensitive layer 40 and the display surface 91. For example, theinfrared cut-off film is arranged between the second substrate 60 andthe collimation layer 70. The infrared cut-off film has a hightransmittance for visible lights, which can reach 90% or more, and a lowtransmittance for infrared light signals, to prevent external infraredlight signals from reaching the photosensitive units 41.

Further, as there are multiple infrared photosensitive units 413, theregenerate multiple infrared electrical signals accordingly which havedifferent sizes, in one example, the infrared electrical signals areaveraged and then the averaged infrared electrical signal is subtractedfrom the imaging electrical signal during performing the subtractionoperation. In another example, photosensitive units 41 and infraredphotosensitive units 413 are partitioned respectively, where each regioninclude at least one photosensitive unit 41, or includes at least oneinfrared photosensitive unit 413. Then, according to a location of eachregion including a photosensitive unit 41 (referred to as a first regionhereinafter) and a location of each region including an infraredphotosensitive unit 413 (referred to as a fifth region hereinafter),fifth regions that are closest to each first region are determined. Foreach photosensitive unit 41 in each first region, an infrared electricalsignal generated by a infrared photosensitive unit 413 in a fifth regionthat is closest to the first region is subtracted from an imagingelectrical signal generated by the photosensitive unit 41, such that afinal electrical signal of the photosensitive unit 41 for imaging isobtained. If the fifth region includes multiple infrared photosensitiveunits 413, an average value of multiple infrared electrical signalsgenerated by the multiple infrared photosensitive units 413 in the fifthregion are obtained, and then the average value is subtracted from theimaging electrical signal, such that a final electrical signal forimaging is obtained. It can be appreciated that the closer a distancebetween an infrared photosensitive unit 413 and a photosensitive unit 41is, the closer amounts of infrared lights received by the infraredphotosensitive unit 411 and the photosensitive unit 41 are, and thecloser the generated interference electrical signals are. Thus, moreaccurate the final electrical signal for imaging after subtracting theinfrared electrical signal from the imaging electrical signal are.

As shown in FIG. 5, any one or more of the stray light photosensitiveunits 411, the noise photosensitive units 412, the noise circuit units422, and the infrared photosensitive units 413 may be disposed on thesame photosensitive layer 40 at the same time. For example, the straylight photosensitive units 411 and the noise photosensitive units 412are arranged at the same time. In this case, the imaging chip 300performs image-calibration according to an interference electricalsignal and a noise electrical signal during imaging, such as subtractingthe interference electrical signal and the noise electrical signal froman imaging electrical signal generated by an imaging light signal toobtain a final electrical signal for imaging. For another example, thestray light photosensitive units 411 and the noise circuit units 422 arearranged at the same time. In this case, the imaging chip 300 performsimage-calibration according to an interference electrical signal and acircuit noise signal during imaging, such as subtracting theinterference electrical signal and the circuit noise signal from animaging electrical signal generated by an imaging light signal to obtaina final electrical signal for imaging. For yet another example, thenoise circuit units 422 and the infrared photosensitive units 413 arearranged at the same time. In this case, the imaging chip 300 performsimage-calibration according to a circuit noise signal and an infraredelectrical signal during imaging, such as subtracting the circuit noisesignal and the infrared electrical signal from an imaging electricalsignal generated by an imaging light signal to obtain a final electricalsignal for imaging. For yet another example, the noise photosensitiveunits 412, the noise circuit units 422, and the infrared photosensitiveunits 413 are arranged at the same time. In this case, the imaging chip300 performs image-calibration according to a noise electrical signal, acircuit noise signal, and an infrared electrical signal during imaging,such as subtracting the noise electrical signal, the circuit noisesignal, and the infrared electrical signal from an imaging electricalsignal generated by an imaging light signal to obtain a final electricalsignal for imaging. For yet another example, a stray lightphotosensitive unit 411, a noise photosensitive unit 412, and aninfrared photosensitive unit 413 are arranged at the same time. In thiscase, the imaging chip 300 performs image-calibration according to aninterference electrical signal, a noise electrical signal, a circuitnoise signal, and an infrared electrical signal during imaging, such assubtracting the interference electrical signal, the noise electricalsignal, the circuit noise signal, and the infrared electrical signalfrom an imaging electrical signal generated by an imaging light signalto obtain a final electrical signal for imaging.

As shown in FIG. 6, in some embodiments, a plurality of display-drivingunits 1 a 1 are arranged in an array with multiple rows and multiplecolumns, and a plurality of photosensitive units 41 are arranged inanother array with multiple rows and multiple columns. each row of thefirst array is located between any adjacent two rows of the secondarray, and each column of the first array is located between anyadjacent two columns of the second array. The effective operating timeof the display-driving units 1 a 1 is alternated with that of thephotosensitive units 41 in a same row or column.

Specifically, during fabrication, the display-driving layer 1 a isfirstly manufactured on the first substrate 30, and then thephotosensitive layer 40 is manufactured on the display driving layer 1a. The display-driving units 1 a 1 are spaced from the photosensitiveunits 41. In the array, there may be multiple photosensitive units 41and multiple display-driving units 1 a 1 located in a same row or columnat the same time, and the effective operating time of thedisplay-driving units 1 a 1 is alternated with that of thephotosensitive units 41 in a same row or column. In an example of FIG.6, display-driving units 1 a 1 in the bottom row operate at same time,and photosensitive units 41 in the bottom row operate simultaneously.The operation time of the display-driving units 1 a 1 is intersectedwith that of the photosensitive units 41, which can reduce interferencefrom the display-driving units 1 a 1 when the photosensitive units 41operate and improve the accuracy of imaging.

In some embodiments, the imaging chip 300 and the driving chip may bearranged in a same flexible circuit board through Chip On Film (COF)technique, and the flexible circuit board is bonded to pins of thedisplay driving layer 1 a and pins of the photosensitive layer 40. pinsof the display driving layer 1 a may be arranged in a row, and pins ofthe photosensitive layer 40 may be arranged in another row. The flexiblecircuit board is bonded to both rows of pins.

In the description of the present specification, the description withreferences to the terms “one embodiment”, “some embodiments”, “example”,“specific example”, or “some examples”, and the like, means that aspecific feature, structure, material, or characteristic described inconnection with the embodiment or example is included in at least oneembodiment or example of the present disclosure. Thus, the illustrativedescriptions of the terms throughout this specification are notnecessarily referring to the same embodiment or example of the presentdisclosure. Furthermore, the specific features, structures, materials,or characteristics may be combined in any suitable manner in one or moreembodiments or examples.

In addition, terms such as “first”, “second”, and the like are usedherein for purposes of description, and are not intended to indicate orimply relative importance or significance or to imply the number ofindicated technical features. Thus, the feature defined with “first”,“second”, and the like may include one or more of such a feature. In thedescription of the present disclosure, “a plurality of” means two ormore, such as two, three, and the like, unless specified limitationotherwise.

Although explanatory embodiments of the present disclosure have beenshown and described above, it would be appreciated that the aboveembodiments are illustrative, and cannot be construed to limit thepresent disclosure. Changes, modifications, alternatives, andtransformations can be made to the embodiments by those skilled in theart, and the scope of the present disclosure is limited by the claimsand equivalents thereof.

What is claimed is:
 1. A display device, comprising a first substrate, aphotosensitive layer, a liquid crystal layer, a second substrate, and acollimation layer that are stacked successively; wherein thephotosensitive layer comprises a plurality of photosensitive units;wherein the second substrate comprises a plurality of display units anda shutter layer having a plurality of first holes, any adjacent two ofthe plurality of display units are spaced by the shutter layer, and eachof the first holes is located between any adjacent two different ones ofthe plurality of display units; and wherein the collimation layercomprises a plurality of collimators, each of the plurality ofcollimators defines a second hole, the second hole is communicated witha corresponding one of the first holes and faces a corresponding one ofthe photosensitive units, and a light signal passes through the secondhole and the corresponding one of the first holes and reaches thecorresponding one photosensitive unit.
 2. The display device of claim 1,wherein the display device has a display surface comprising a displayarea, and projections of the plurality of photosensitive units on thedisplay surface are located in the display area.
 3. The display deviceof claim 1, wherein the display device has a display surface, eachcollimator is made from light-absorbing material, and an extensiondirection of the second hole is perpendicular to the display surface. 4.The display device of claim 1, wherein a ratio of a section width of thesecond hole to a depth of the second hole is less than 0.2.
 5. Thedisplay device of claim 1, wherein the shutter layer is located betweenthe collimation layer and the plurality of photosensitive units, andprojections of the plurality of collimators on the second substrate arelocated on the shutter layer.
 6. The display device of claim 1, whereinreflective-material is arranged on a side of each of the plurality ofphotosensitive units facing the first substrate.
 7. The display deviceof claim 1, wherein the plurality of photosensitive units are arrangedin an array, and the plurality of photosensitive units comprise one ormore of a plurality of stray light photosensitive units, a plurality ofnoise photosensitive units, and a plurality of infrared photosensitiveunits.
 8. The display device of claim 7, wherein the plurality of straylight photosensitive units are distributed in two columns of the array,and one of the two columns is adjacent to one of two opposite edges ofthe array and the other of the two columns is adjacent to the other ofthe two opposite edges of the array.
 9. The display device of claim 8,wherein the display device further comprises a cover plate comprising adisplay surface and a back surface that are opposite to each other, anink layer is arranged on the back surface, projections of the straylight photosensitive units on the back surface are located in an areawhere the ink layer is located, and the ink layer is configured forblocking an external light signal penetrating into the cover plate. 10.The display device of claim 9, wherein the ink layer is arranged near anedge of the back surface.
 11. The display device of claim 7, wherein theplurality of noise photosensitive units are distributed in two secondcolumns of the array, and one of the two second columns of the array isnear one of two opposite edges of the array and the other of the twosecond columns of the array is near to the other of the two oppositeedges of the array.
 12. The display device of claim 11, wherein thedisplay device further comprises a blocker, the block is arranged on acollimator facing a corresponding one of the noise photosensitive unitsand is configured for blocking the second hole of the collimator. 13.The display device of claim 1, wherein the photosensitive layer furthercomprises a plurality of circuit units comprising a plurality ofphotosensitive circuit units and one or more noise circuit unit, andeach of the plurality of the photosensitive units is connected with onephotosensitive circuit unit, each noise circuit unit is unconnected withany one of the plurality of the photosensitive units.
 14. The displaydevice of claim 13, wherein the plurality of circuit units are arrangedin an array comprising a plurality of rows and a plurality of columns,and the one or more noise circuit unit is arranged in at least one wholerow and one whole column of the array.
 15. The display device of claim7, wherein the plurality of infrared photosensitive units are evenlydistributed in the array.
 16. The display device of claim 1, wherein aplurality of display-driving units are arranged on the first substrateand in a first array comprising a plurality of rows and a plurality ofcolumns; the plurality of photosensitive units are arranged in a secondarray comprising a plurality of rows and a plurality of columns; eachrow of the first array is located between any adjacent two rows of thesecond array, and each column of the first array is located between anyadjacent two columns of the second array; and the display-driving unitshave an effective operation time alternated with that of thephotosensitive units in a same row or column.
 17. An electronic device,comprising: a housing; and a display device installed in the housing andcomprising a first substrate, a photosensitive layer, a liquid crystallayer, a second substrate, and a collimation layer that are stackedsuccessively; wherein the photosensitive layer comprises a plurality ofphotosensitive units; wherein the second substrate comprises a pluralityof display units and a shutter layer having a plurality of first holes,any adjacent two of the plurality of display units are spaced by theshutter layer, and each of the first holes is located between anyadjacent two different ones of the plurality of display units; andwherein the collimation layer comprises a plurality of collimators, eachof the plurality of collimators defines a second hole communicated witha corresponding one of the first holes and facing a corresponding one ofthe photosensitive units, and a light signal passes through the secondhole and the corresponding one of the first holes and reaches thecorresponding one photosensitive unit.
 18. The electronic device ofclaim 17, wherein the plurality of photosensitive units are arranged inan array and comprise one or more of a plurality of stray lightphotosensitive units, a plurality of noise photosensitive units, and aplurality of infrared photosensitive units.
 19. An electronic device,comprising a display assembly comprising a first substrate, aphotosensitive layer, a liquid crystal layer, a second substrate, and acollimation layer that are stacked successively; wherein thephotosensitive layer comprises a set of photosensitive units comprisingat least one photosensitive unit; wherein the second substrate comprisesa plurality of display units and a shutter layer having a plurality offirst holes, any adjacent two of the plurality of display units arespaced by the shutter layer, and one of the first holes is locatedbetween any adjacent two different ones of the plurality of displayunits; and wherein the collimation layer comprises a plurality ofcollimators, each of the plurality of collimators defines a second hole,the second hole is communicated with a corresponding one of the firstholes and faces a corresponding one of the at least one photosensitiveunit, and a light signal passes through the second hole and thecorresponding one of the first holes and reaches the corresponding onephotosensitive unit.
 20. The electronic device of claim 19, wherein theset of photosensitive units is arranged in an array comprise one or moreof a plurality of stray light photosensitive units, a plurality of noisephotosensitive units, and a plurality of infrared photosensitive units.